Media Summary: Our mask-less self-patterning wet chemical plating process applies Nickel, Palladium and Gold over the Aluminium or Copper ... Ultra-SB² is a fully automated solder bumping equipment with integrated flux printing, ball placement, 2D inspection and wafer ... The SB²-Jet provides fine-pitch soldering capability supported by a high accuracy axis system. It has the smallest solder ball ...
This Is Pactech Packaging Technology - Detailed Analysis & Overview
Our mask-less self-patterning wet chemical plating process applies Nickel, Palladium and Gold over the Aluminium or Copper ... Ultra-SB² is a fully automated solder bumping equipment with integrated flux printing, ball placement, 2D inspection and wafer ... The SB²-Jet provides fine-pitch soldering capability supported by a high accuracy axis system. It has the smallest solder ball ... Using localized laser heating mechanism, temperature can be applied selectively in the interconnection areas of interest without ... This video demonstrates the capability of selective solder bumping for deballing and reballing by
