Media Summary: Featured Speakers: Kyle Thomas, Vice President of Engineering and Compliance Services, Elevate; Dr. Parag Mitra, Principal ... Phase 1 end-of-project and Phase 2 call-for-participation webinar April 29, 2025 This major online workshop by ESIG, NAGF, NERC and EPRI covers the important relationships between

Inemi Interim Report Interconnection Modeling - Detailed Analysis & Overview

Featured Speakers: Kyle Thomas, Vice President of Engineering and Compliance Services, Elevate; Dr. Parag Mitra, Principal ... Phase 1 end-of-project and Phase 2 call-for-participation webinar April 29, 2025 This major online workshop by ESIG, NAGF, NERC and EPRI covers the important relationships between Call-for-Participation Webinar: Comparison of Expanded Beam and Physical Contact Connectors in Data Center Applications ... Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI) PJM NextGen is the official online portal for submitting generation

Chair: Jens Boemer, Technical Executive, EPRI Compliance Assessment Process Babak Badrzadeh, Technical Director – Power ... Tom Okrasinski (Nokia Bell Labs) and Fu Zhao (Purdue University), Co-chairs,

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INEMI Interim Report: Interconnection Modeling & Simulation Results—LTM in 1st Level Interconnect
iNEMI High Density Interconnect Socket Warpage Prediction & Characterization End-of-Project Webinar
iNEMI’s Eco-Design for Circular Electronics Economy Series Final Report — Introduction
Webinar: Integrating Large Loads Interconnection, Performance Requirements, and Modeling
Part 1: INEMI Electromigration of SnBi Solder for Second-Level Interconnect Project
Joint Generator Interconnection Workshop Day 2: Interconnection Studies and Modeling
Board Assembly Roadmap Webinar (September 4, 2025)
iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project
Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)
PJM NextGen Explained: How to Submit a Generation Interconnection Application Step by Step
Call-for-Participation: Electromigration of SnBi Solder for Second-Level Interconnect Project
2023 Fall Technical Workshop: Session 4: Grid Code Interconnection Requirements Assessment
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INEMI Interim Report: Interconnection Modeling & Simulation Results—LTM in 1st Level Interconnect

INEMI Interim Report: Interconnection Modeling & Simulation Results—LTM in 1st Level Interconnect

Thursday, June 19

iNEMI High Density Interconnect Socket Warpage Prediction & Characterization End-of-Project Webinar

iNEMI High Density Interconnect Socket Warpage Prediction & Characterization End-of-Project Webinar

April 28 & 29, 2022 High-density

iNEMI’s Eco-Design for Circular Electronics Economy Series Final Report — Introduction

iNEMI’s Eco-Design for Circular Electronics Economy Series Final Report — Introduction

The

Webinar: Integrating Large Loads Interconnection, Performance Requirements, and Modeling

Webinar: Integrating Large Loads Interconnection, Performance Requirements, and Modeling

Featured Speakers: Kyle Thomas, Vice President of Engineering and Compliance Services, Elevate; Dr. Parag Mitra, Principal ...

Part 1: INEMI Electromigration of SnBi Solder for Second-Level Interconnect Project

Part 1: INEMI Electromigration of SnBi Solder for Second-Level Interconnect Project

Phase 1 end-of-project and Phase 2 call-for-participation webinar April 29, 2025

Joint Generator Interconnection Workshop Day 2: Interconnection Studies and Modeling

Joint Generator Interconnection Workshop Day 2: Interconnection Studies and Modeling

This major online workshop by ESIG, NAGF, NERC and EPRI covers the important relationships between

Board Assembly Roadmap Webinar (September 4, 2025)

Board Assembly Roadmap Webinar (September 4, 2025)

This webinar reviews

iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project

iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project

Call-for-Participation Webinar: Comparison of Expanded Beam and Physical Contact Connectors in Data Center Applications ...

Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)

Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)

Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI)

PJM NextGen Explained: How to Submit a Generation Interconnection Application Step by Step

PJM NextGen Explained: How to Submit a Generation Interconnection Application Step by Step

PJM NextGen is the official online portal for submitting generation

Call-for-Participation: Electromigration of SnBi Solder for Second-Level Interconnect Project

Call-for-Participation: Electromigration of SnBi Solder for Second-Level Interconnect Project

(January 11 & 13, 2022)

2023 Fall Technical Workshop: Session 4: Grid Code Interconnection Requirements Assessment

2023 Fall Technical Workshop: Session 4: Grid Code Interconnection Requirements Assessment

Chair: Jens Boemer, Technical Executive, EPRI Compliance Assessment Process Babak Badrzadeh, Technical Director – Power ...

iNEMI Roadmap Webinar on Sustainable Electronics (February 13, 2025)

iNEMI Roadmap Webinar on Sustainable Electronics (February 13, 2025)

Tom Okrasinski (Nokia Bell Labs) and Fu Zhao (Purdue University), Co-chairs,