Media Summary: April 2/3, 2026 As high-performance computing and AI accelerators drive systems to unprecedented power levels, effective ... October 14, 2021 Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI) The electronics manufacturing industry is ... CAF (conductive anodic filament) failures are the result of an electrochemical migration (ECM) process that causes short circuits in ...

Inemi Call For Participation Webinar - Detailed Analysis & Overview

April 2/3, 2026 As high-performance computing and AI accelerators drive systems to unprecedented power levels, effective ... October 14, 2021 Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI) The electronics manufacturing industry is ... CAF (conductive anodic filament) failures are the result of an electrochemical migration (ECM) process that causes short circuits in ... January 17 & 18, 2022 The presentation from this project's recent Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI) Hybrid PCBs for Next Generation Applications Project December 7, 2022 An increasing range of high-speed applications require ...

Photo Gallery

INEMI Electronic Product Dataset Project Call-for-Participation Webinar (April 29, 2025)
INEMI Call-for-Participation Webinar:Thermal Interface Material Performance Characterization Project
iNEMI's PCB Connector Footprint Tolerance Project Call-for-Participation Webinar (May 9 & 10, 2023)
Call-for-Participation Webinar: iNEMI Development of an Imaging AOI + AI Ecosystem Project
iNEMI Call-for-Participation Webinar: Conformal Coating Evaluation, Phase 3
iNEMI Call-for-Participation Webinar: Unified Equipment Interaction Methodology Project
iNEMI Call-for-Participation Webinar: Investigation of AI Enhancement to AOI for PCBA Project
iNEMI RDL Adhesion Strength Measurement Project Call-for-Participation Webinar
iNEMI Call-for-Participation Webinar: CAF and ECM Failure Mitigation Project (September 7, 2022)
Call for Participation: Moisture Induced Expansion Metrology for Packaging Polymetric Materials
Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)
iNEMI PLP Fine Pitch Substrate Inspection/Metrology Project, Phase 4 Call-for-Participation Webinar
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INEMI Electronic Product Dataset Project Call-for-Participation Webinar (April 29, 2025)

INEMI Electronic Product Dataset Project Call-for-Participation Webinar (April 29, 2025)

This

INEMI Call-for-Participation Webinar:Thermal Interface Material Performance Characterization Project

INEMI Call-for-Participation Webinar:Thermal Interface Material Performance Characterization Project

April 2/3, 2026 As high-performance computing and AI accelerators drive systems to unprecedented power levels, effective ...

iNEMI's PCB Connector Footprint Tolerance Project Call-for-Participation Webinar (May 9 & 10, 2023)

iNEMI's PCB Connector Footprint Tolerance Project Call-for-Participation Webinar (May 9 & 10, 2023)

This

Call-for-Participation Webinar: iNEMI Development of an Imaging AOI + AI Ecosystem Project

Call-for-Participation Webinar: iNEMI Development of an Imaging AOI + AI Ecosystem Project

September 1 & 2, 2022

iNEMI Call-for-Participation Webinar: Conformal Coating Evaluation, Phase 3

iNEMI Call-for-Participation Webinar: Conformal Coating Evaluation, Phase 3

December 1, 2022

iNEMI Call-for-Participation Webinar: Unified Equipment Interaction Methodology Project

iNEMI Call-for-Participation Webinar: Unified Equipment Interaction Methodology Project

July 7 & 8, 2022

iNEMI Call-for-Participation Webinar: Investigation of AI Enhancement to AOI for PCBA Project

iNEMI Call-for-Participation Webinar: Investigation of AI Enhancement to AOI for PCBA Project

October 14, 2021 Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI) The electronics manufacturing industry is ...

iNEMI RDL Adhesion Strength Measurement Project Call-for-Participation Webinar

iNEMI RDL Adhesion Strength Measurement Project Call-for-Participation Webinar

This new project recently held a

iNEMI Call-for-Participation Webinar: CAF and ECM Failure Mitigation Project (September 7, 2022)

iNEMI Call-for-Participation Webinar: CAF and ECM Failure Mitigation Project (September 7, 2022)

CAF (conductive anodic filament) failures are the result of an electrochemical migration (ECM) process that causes short circuits in ...

Call for Participation: Moisture Induced Expansion Metrology for Packaging Polymetric Materials

Call for Participation: Moisture Induced Expansion Metrology for Packaging Polymetric Materials

January 17 & 18, 2022 The presentation from this project's recent

Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)

Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)

Project Chair: Wayne Zhang (IBM) Co-Chair: Philip A. Reyes (IMI)

iNEMI PLP Fine Pitch Substrate Inspection/Metrology Project, Phase 4 Call-for-Participation Webinar

iNEMI PLP Fine Pitch Substrate Inspection/Metrology Project, Phase 4 Call-for-Participation Webinar

January 20, 2022 Phase 4 of

Call for Participation: iNEMI Hybrid PCBs for Next Generation Applications (December 7, 2022)

Call for Participation: iNEMI Hybrid PCBs for Next Generation Applications (December 7, 2022)

Hybrid PCBs for Next Generation Applications Project December 7, 2022 An increasing range of high-speed applications require ...