Media Summary: Indium Corporation provides high-performance precision gold preforms. Its Introducing Indium Corporation's off-eutectic gold-tin preforms—these high-reliability, precision gold solder solutions are designed ... Learn how the package in which the gallium nitride (GaN) device is

Aultra Thinforms For Die Attach - Detailed Analysis & Overview

Indium Corporation provides high-performance precision gold preforms. Its Introducing Indium Corporation's off-eutectic gold-tin preforms—these high-reliability, precision gold solder solutions are designed ... Learn how the package in which the gallium nitride (GaN) device is InFORMS® are reinforced solder preforms with a unique composition that offers enhanced reliability. Learn more about how they ... Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of voiding in thermal ... At Indium Corporation, we're redefining how we use solder at the

For years, people have been using gold-tin in high-temperature applications, but we have the ongoing problem of voiding. It's not ... A review of a technical paper: Indium Corporation engineers have developed a novel laminate composite solder preform, ... Q & A with Indium Corporation's Seth Homer. Vishay EFI offers an 80/20 eutectic AuSn sputter that is used for precise component placement. Learn more about the AuSn ... Indium Corporation's Product Manager of PCB Solder Paste Glen Thomas discusses the reliability of Indium10.1 and Indium8.9HF ... Solder Preform SMT feeder -- FUJI NXT 、Panasonic etc. Shenzhen Southern Machinery Sales And Service Co. Ltd. Add :Rm ...

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AuLTRA™ ThInFORMS™ for Die-Attach Applications
AuLTRA® ThInFORMS™: 80Au20Sn Preforms for High-Output Lasers
Off-Eutectic Gold Tin Preforms
Packages and Eutectic Die Attach for High Power GaN Devices
InFORMS®—A Different Kind of Preform
Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials
Solder Redefined Video 4: Baseplate to Heat-Sink
Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints
Composite Solder Alloy Preform For High Temperature Pb-Free Soldering Applications
Indium Corporation:  Preforms for thermal applications
Benefits and Design Rules of Sputtered AuSn
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void™
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AuLTRA™ ThInFORMS™ for Die-Attach Applications

AuLTRA™ ThInFORMS™ for Die-Attach Applications

Indium Corporation provides high-performance precision gold preforms. Its

AuLTRA® ThInFORMS™: 80Au20Sn Preforms for High-Output Lasers

AuLTRA® ThInFORMS™: 80Au20Sn Preforms for High-Output Lasers

Indium Corporation's

Off-Eutectic Gold Tin Preforms

Off-Eutectic Gold Tin Preforms

Introducing Indium Corporation's off-eutectic gold-tin preforms—these high-reliability, precision gold solder solutions are designed ...

Packages and Eutectic Die Attach for High Power GaN Devices

Packages and Eutectic Die Attach for High Power GaN Devices

Learn how the package in which the gallium nitride (GaN) device is

InFORMS®—A Different Kind of Preform

InFORMS®—A Different Kind of Preform

InFORMS® are reinforced solder preforms with a unique composition that offers enhanced reliability. Learn more about how they ...

Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials

Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials

Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of voiding in thermal ...

Solder Redefined Video 4: Baseplate to Heat-Sink

Solder Redefined Video 4: Baseplate to Heat-Sink

At Indium Corporation, we're redefining how we use solder at the

Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints

Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints

For years, people have been using gold-tin in high-temperature applications, but we have the ongoing problem of voiding. It's not ...

Composite Solder Alloy Preform For High Temperature Pb-Free Soldering Applications

Composite Solder Alloy Preform For High Temperature Pb-Free Soldering Applications

A review of a technical paper: Indium Corporation engineers have developed a novel laminate composite solder preform, ...

Indium Corporation:  Preforms for thermal applications

Indium Corporation: Preforms for thermal applications

Q & A with Indium Corporation's Seth Homer.

Benefits and Design Rules of Sputtered AuSn

Benefits and Design Rules of Sputtered AuSn

Vishay EFI offers an 80/20 eutectic AuSn sputter that is used for precise component placement. Learn more about the AuSn ...

Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void™

Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void™

Indium Corporation's Product Manager of PCB Solder Paste Glen Thomas discusses the reliability of Indium10.1 and Indium8.9HF ...

Solder wire Preformer feeder A

Solder wire Preformer feeder A

Solder Preform SMT feeder -- FUJI NXT 、Panasonic etc. Shenzhen Southern Machinery Sales And Service Co. Ltd. Add :Rm ...